Equipped with ECC error‑correction, supporting 7×24‑hour high‑speed stable operation. Industrial‑grade anti‑interference & wide‑temperature, low‑power, compatible with servers and AI computing devices.

Copper‑aluminum composite for high‑efficiency heat conduction, low thermal resistance & low‑noise stable performance. Supports 7×24‑hour high‑power heat dissipation, compatible with AI compute modules and servers.

Multi‑chip integrated AI acceleration module, equipped with large‑capacity high‑speed HBM memory, high computing throughput. Enterprise‑grade 7×24‑hour continuous operation, ideal for large‑scale AI computing clusters.

Enterprise‑grade high‑speed SSD, high‑IO read‑write performance, high durability. Supports 7×24‑hour full‑load operation, suitable for AI servers and data‑center storage.

High-performance AI GPU, powerful parallel computing capability and large memory. Stable full-load operation for 7×24 hours, suitable for AI training, inference and high-performance computing.

Standard PCIe form‑factor, plug‑and‑play with high computing power and large memory. Support 7×24‑hour stable operation, quickly upgrade AI computing power for existing servers without hardware reconstruction.

High-density AI computing server with multi-GPU expansion capability and integrated cooling system. Supports 7×24-hour stable operation, delivering one-stop support for large model training and inference.

High-performance SXM GPU module with high-bandwidth interconnect and powerful computing capacity. Integrated cooling design supports stable 7×24-hour full-load operation, suitable for high-density AI computing clusters.

Pre-integrated AI whole-machine platform, pre-tested before delivery with flexible computing configuration. Supports 7×24-hour stable operation, ready for deployment of large model training and inference out of box.